Determining the arterial stiffness through contour analysis of a PPG and its association with HbA1c among diabetic patients in Malaysia - doi: 10.4025/actascitechnol.v36i1.17096

Autores

  • Sahnius Usman Universiti Kebangsaan Malaysia Autor
  • Mamun Bin Ibne Reaz Universiti Kebangsaan Malaysia Autor
  • Mohd Alauddin Mohd Ali Universiti Kebnagsaan Malaysia Autor

DOI:

https://doi.org/10.4025/actascitechnol.v36i1.17096

Palavras-chave:

atherosclerosis, cardiovascular disease, diabetes mellitus, vascular endothelium, photoplethysmogram

Resumo

Diabetes mellitus accelerates atherosclerosis. Monitoring arterial condition promises to be an advantage in the detection of any abnormalities. In this study, the characteristics of analysis by photoplethysmogram (PPG) were investigated non-invasively among diabetic patients. An area under the curve (auc-PPG) was compared for two levels of HbA1c, namely HbA1c < 8% (Group 1) and HbA1c > 10% (Group 2). Auc-PPG was found to be significantly higher among diabetic subjects with HbA1c<8% than among those with HbA1c > 10%. Further analysis was performed to investigate the effect of age on auc-PPG. The mean values of auc-PPG were still significantly higher among diabetic patients with HbA1c < 8% than among those with HbA1c > 10%. These results show that the auc-PPG method could be a parameter in determining the arterial stiffness in relation to the level of HbA1c.

 


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Biografia do Autor

  • Sahnius Usman, Universiti Kebangsaan Malaysia
    Electrical, Electronic and Systems Engineering
  • Mamun Bin Ibne Reaz, Universiti Kebangsaan Malaysia
    Electrical, Electronic and Systems Engineering
  • Mohd Alauddin Mohd Ali, Universiti Kebnagsaan Malaysia
    Electrical, Electronic and Systems Engineering

Publicado

2014-01-07

Edição

Seção

Informação Tecnológica

Como Citar

Determining the arterial stiffness through contour analysis of a PPG and its association with HbA1c among diabetic patients in Malaysia - doi: 10.4025/actascitechnol.v36i1.17096. (2014). Acta Scientiarum. Technology, 36(1), 123-128. https://doi.org/10.4025/actascitechnol.v36i1.17096

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